Microchip Fabrication: A Practical Guide to Semiconductor Processing
Microchip Fabrication, 5th Ed.: Van Zant, Peter - Amazon.com microchip fabrication peter van zant pdf
After fabrication, the wafer undergoes using microscopic probes. Good dies are marked. The essay describes backgrinding (thinning the wafer from 750µm to 150µm), die sawing , die attach to a lead frame, wire bonding (or modern flip-chip solder bumps), and finally molding into a plastic or ceramic package. 5th Ed.: Van Zant
If you need this book for a class or career change, skip the shady PDF links. Here is the best route: Peter - Amazon.com After fabrication